The FLEX Test Platform offers a broad range of single board, high-performance, high-density analog (AC and DC) and digital instruments that replicate the device operating environment for test. The range of instrumentation lets users apply the best test strategy for high performance digital or high precision analog at package or probe. All FLEX Test Platform systems can be configured to test a particular mix of devices and then as test requirements change the system can be quickly adapted by adding or relocating instrumentation, said Kevin Ritchie, Senior Vice President Technology Manufacturing Group, TI.
Teradyne's Universal Slot test head design provides us with flexible system configurations that enable the widest device test coverage at the lowest cost of test. We've enjoyed great success on our test floor with the FLEX and TI is pleased to join Teradyne in celebrating their success in shipping the 1000th system. Teradyne is committed to working with TI and all our customers to create the ultimate production test solution that yields technical and economic advantages on their test floor, said Mark Jagiela, President, Semiconductor Test Division, Teradyne.
I'd like to thank TI for their contributions, over the years, to our mutual success. The FLEX Test Platform provides a next-generation architecture and advanced test technologies to deliver cost of test reductions, critical in the price sensitive high volume consumer product device market, and system flexibility with broad coverage for high mix low volume production environments. This unique test architecture drives four core capabilities: highest efficiency multisite test that eliminates test time overhead, broadest technology coverage with a suite of high-density instrumentation, interactive software with the fastest programming time for multisite test and an open platform architecture for specialized test requirements.
The Teradyne FLEX Test Platform advances test technologies in an architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from (SOC) and System-In-Package (SIP) devices for consumer, automotive, mass storage, wireless, and data communications applications.
The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL(TM) software operating system provides fast program development, including instant conversion from single to multi-site test.
And, the OpenFLEX(TM) open system architecture complements the FLEX Platform's broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit . Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries.
In 2005, Teradyne had sales of $1.08 billion, and currently employs about 4,000 people worldwide. For more information, visit www.
teradyne.com. Teradyne(R), FLEX, microFLEX, Sync-Link, System Broadcast, Background DSP, IG-XL, and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc.
in the US and other countries.
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